Mitsubishi Electric EV Chip Samples Begin June Shipments
1h ago|4 min readStandard
Fazen Markets Editorial Desk
Collective editorial team · methodology
semiconductorselectric-vehicles
Fazen Markets Editorial Desk
Collective editorial team · methodology
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Mitsubishi Electric announced on 4 June 2026 that it will begin shipping sample units of its fifth-generation silicon carbide power modules for electric vehicles to key automakers starting this month. The launch targets a critical component bottleneck in the global EV transition. The event follows a 2023 industry commitment by Mitsubishi to double SiC production capacity by 2025. Rival chipmaker Infineon shipped its first Gen5 automotive samples in November 2025.
The global power semiconductor market for xEVs will reach $7.8 billion by 2028, according to Yole Group data from Q3 2025. The last major generational shift occurred in 2022-2023 when several Tier 1 suppliers, including onsemi, moved volume production to their 3rd-gen SiC platforms, achieving 20-30% efficiency gains over silicon IGBTs. That transition helped extend EV range by an average of 5-7%.
Current market conditions see elevated demand for power-dense, efficient chips as automakers push 800-volt architectures to shorten charging times. The 10-year JGB yield sits near 0.92%, providing a favorable borrowing environment for Japanese industrial capex. Treasury yields are at 4.26%.
Mitsubishi’s 5th-gen release follows a three-year, $700 million capital expenditure program focused on its Kumamoto and Fukui prefabrication sites. The trigger is the 2026-2027 model year design-in cycles, where automakers finalize powertrain components for vehicles launching in 2028-2029. Delays in sampling risk exclusion from these multi-year supply contracts.
Mitsubishi Electric’s Power Device Works division reported sales of 243.1 billion yen ($1.55 billion) for FY2025, a 14% year-over-year increase. The company’s total SiC power device sales grew 74% in the same period. The new 5th-gen module reduces power losses by 40% compared to the company’s 4th-gen product, which launched in 2021.
| Metric | 4th-Gen (2021) | 5th-Gen (2026) |
|---|---|---|
| Power Loss Reduction (vs. IGBT baseline) | 70% | 80%+ |
| Maximum Operating Temperature | 175°C | 200°C |
Infineon’s automotive segment revenue was €5.8 billion ($6.2 billion) in its last fiscal year. The Bloomberg World Semiconductor Index is up 18% year-to-date, outperforming the MSCI World Index’s 7% gain. Mitsubishi holds a 9% global market share in power modules, trailing Infineon (19%) and onsemi (12%).
The direct second-order effect is margin pressure on European and U.S. SiC leaders like Infineon (IFX.DE) and onsemi (ON). A credible Japanese entrant with keiretsu ties to Toyota and Honda could capture 2-3 percentage points of market share by 2030, translating to a $150-$230 million revenue headwind for the incumbents. Conversely, Japanese automakers Nissan (7201.T) and Subaru (7270.T) gain a diversified, domestic supply option, potentially improving gross margins by 50-75 basis points on future EV lines.
A key limitation is Mitsubishi’s historical focus on industrial and rail applications, not the harsh qualification cycles of automotive grade-0 components. This could slow adoption outside its traditional partner network. Current market positioning shows long interest in Wolfspeed (WOLF), the primary SiC wafer supplier, and short flows into silicon-based power device makers like STMicroelectronics (STM), which is transitioning its product mix.
The primary catalyst is the Q4 2026 design-win announcements from Toyota and Honda, expected by December. A second catalyst is the U.S. Department of Energy’s next funding round for advanced semiconductor manufacturing, scheduled for August 2026, which may include SiC grants. Third, watch the Q3 2026 earnings calls of Infineon and onsemi for commentary on pricing discipline.
The 200-day moving average for the SOXX semiconductor ETF at $680 is a key technical support level. Watch for a breakout above $720 on volume confirming sector momentum. In credit markets, monitor spreads on Mitsubishi Electric’s 2031 bonds for signs of rating agency confidence in the capex program’s return profile.
Tesla's Dojo is a supercomputer training chip for AI, not a power module for managing electricity in an EV's motor or battery. Mitsubishi's 5th-gen product is a Silicon Carbide power device, analogous to the chips Tesla sources from suppliers like STMicroelectronics for its drive units. The comparison highlights the bifurcation between AI compute and power control semiconductors in the automotive stack.
Japanese firms, led by Fuji Electric and Mitsubishi, held over 30% of the global insulated-gate bipolar transistor market a decade ago. That share eroded to approximately 22% by 2025 due to consolidation and aggressive investment by European and American rivals. The 5th-gen launch represents a strategic bid to regain relevance in the higher-margin, faster-growing SiC segment, reversing a decade of relative decline.
An 800-volt vehicle electrical system allows for faster charging but requires power semiconductors that can handle higher voltages without significant energy loss as heat. SiC chips are more efficient at these higher voltages than traditional silicon. Mitsubishi's new module is specifically engineered for 800V platforms, making it a prerequisite for automakers targeting charge times under 20 minutes, a key competitive benchmark for 2028 model years.
Mitsubishi Electric’s sampling launch is a late but critical bid to capture share in the high-stakes SiC market before 2028 EV production lines are locked in.
Disclaimer: This article is for informational purposes only and does not constitute investment advice. CFD trading carries high risk of capital loss.
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